Archive for the 'Handhelds' Category

Nov 08 2007

OKI Develops Technology to Miniaturize Camera Modules for Mobile Phones

OKIOki announced it has started a contract assembly service for W-CSP (Wafer level Chip Sized Package) semiconductors using through-hole technology. With this technology, OKIs customers such as sensor and camera module manufacturers can now obtain camera modules that are half the size of conventional modules. In September, OKI established a volume production line for through-whole technology based W-CSP assembly at its production site in Tokyo and started operation in October. Continue Reading »

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