SBGadget

Oki announced it has started a contract assembly service for W-CSP (Wafer level Chip Sized Package) semiconductors using through-hole technology. With this technology, OKI’s customers such as sensor and camera module manufacturers can now obtain camera modules that are half the size of conventional modules. In September, OKI established a volume production line for through-whole technology based W-CSP assembly at its production site in Tokyo and started operation in October. Continue Reading »